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IRS26072DSPbF
PCB Layout Tips
Distance between high and low voltage components: It’s strongly recommended to place the components tied to
the floating voltage pins (V B and V S ) near the respective high voltage portions of the device. Please see the Case
Outline information in this datasheet for the details.
Ground Plane: In order to minimize noise coupling, the ground plane should not be placed under or near the high
voltage floating side.
Gate Drive Loops: Current loops behave like antennas and are able to receive and transmit EM noise (see Figure
20). In order to reduce the EM coupling and improve the power switch turn on/off performance, the gate drive
loops must be reduced as much as possible. Moreover, current can be injected inside the gate drive loop via the
IGBT collector-to-gate parasitic capacitance. The parasitic auto-inductance of the gate loop contributes to
developing a voltage across the gate-emitter, thus increasing the possibility of a self turn-on effect.
V B
(or V CC )
I GC
HO
(or LO )
R G
Gate Drive
Loop
V GE
C GC
V S
(or COM)
Figure 20: Antenna Loops
Supply Capacitor: It is recommended to place a bypass capacitor between the VCC and COM pins. This
connection is shown in Figure 21. A ceramic 1 μF ceramic capacitor is suitable for most applications. This
component should be placed as close as possible to the pins in order to reduce parasitic elements.
Up t o 600V
Vcc
Vcc
HIN1,2,3
LIN1,2,3
HIN1,2,3
LIN1,2,3
V B1,2,3
HO1,2,3
V S 1,2,3
TO
LOAD
LO1,2,3
COM
GND
Figure 21: Supply capacitor
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